TPP polishing machine
Manual polishing machine for semiconductor material, geeignet für Wafer bis zu 6" Durchmesser.
Features
- Three phase motor with improved true running.
- Infinitely variable speed of the polishing plate.
- Vacuum system.
- Centering nut enables fast exchange of polishing pad.
- Slurry feeding.
- Wafer centering by roller system
- Rotating polishing chucks
Pictures
- TPP polishing machine
- Detailed view
Technical Data
| Polishing disk | Ø 360 mm |
| Polishing pad | Ø 350 mm |
| Speed | 50 - 350 min-1 |
| Motor | 0,55 kW |
| Noise | < 67 dB(A) |
| Space | 1200 X 542 mm |
| Weight | 123 kg |