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Precision plunge grinding machine with cassette-to-cassette operation, post-process wafer measuring system, and 3 axes CNC control.

Back grinding semiconductor wafers.

The best in wafer tolerances and minimum damage depth is achieved with the maximum in stock removal and production rates.

The patented principle of plunge cut grinding guarantees the maximum possible protection against damage or breakage of the wafer.

The abrasive face of the diamond grinding wheel is wider than the wafer diameter. With the spindle feed in the axial direction, the back of the wafer is ground in one operation.

Shortly before the programmed wafer thickness is reached, the downfeed stops. While the table rotates slowly, the wafer is finish ground by an additional outer grinding ring which projects down slightly beyond the face of the main grinding wheel.

This operation provides the finishing grind to produce the desired thickness. Surface finish and damage depth can be improved significantly, if the outer ring utilized is of a finer diamond grit size.

Motor	4 kW
Spindle speed	1450 min-1
Power connection	8 kW
Wafer size	2"- 6"
Diamond wheel	max. 400 mm
Rotary table
Rotary table speed	0,05-30 min-1
Number of chucks	2
Fine downfeed	0,1 - 50 mm/min
Accuracy
TTV	<3 µm
Ra	0,06-0,6 µm
Variation	<3 µm
Weight	2550 kg
Space	ca. 2800 x 1660 mm