G&N Machines for Semiconductor working
Semi-automatic grinders for wafer with 2" up to 8" dia. Full-automatic machines of the NANO-Series for automatic cassett-to-cassette grinding of semiconductor-material up to 300 mm. Grinders for special-materials like GaAs, sapphire, silicon and technical ceramics.
Manual polishing machine for semiconductor material for wafer up to 6" diameter.
High precision grinding machine for grinding of non-ferrous material and semiconductor material.
A adaption of the MPS 2 R300, special designed for grinding semiconductor material.
Fully automatic vertical high precision surface grinder with rotary table and vacuum chucks.This high precision surface grinder is a further development of the well-known MPS 2 R300-series.
The MPS R400 line of machines have been designed to take advantage of state-of-the-art grinding technologies and ergonomics. The fully encapsulated grinding area offers optimum environmental conditions for the operator and reduces risks of contamination. This concept has been developed and refined for maximum precision when grinding metals, silicon and other semiconductor materials in small batch production, research and development.
The MPS R400 line of machines have been designed to take advantage of state-of-the-art grinding technologies and ergonomics. The fully encapsulated grinding area offers optimum environmental conditions for the operator and reduces risks of contamination. This concept has been developed and refined for maximum precision when grinding metals, silicon and other semiconductor materials in small batch production, research and development.
MPS 3HS - precision surface grinding machine
Precision surface grinding machine with fully automatic grinding cycles, inprocess gage, vacuum clamping and controllable damage depths.
Precision plunge grinding machine with cassette-to-cassette operation, post-process wafer measuring system, and 3 axes CNC control.
Facing ingots made of silicon and other semi-conductor material up to 320 mm diameter and 600 mm length.
High precision fully automatic wafer grinding machine with two spindles and cassette-to-cassette operation.
High precision fully automatic wafer grinding machine with two spindles and cassette-to-cassette operation.