Sitemap Contact Disclaimer 

The MPS R400 line of machines have been designed to take advantage of state-of-the-art grinding technologies and ergonomics. The fully encapsulated grinding area offers optimum environmental conditions for the operator and reduces risks of contamination. This concept has been developed and refined for maximum precision when grinding metals, silicon and other semiconductor materials in small batch production, research and development.
This new design is equiped both with a grinding- and a polishing spindle.

The major application is the grinding and polishing of silicon and GaAs in the 50 mm up to 150 mm range.

• Closed grinding area
• TWIN SPINDLE with diamond grinding wheels
• Automatic switch over from grinding to polishing
• Temperature guided polishing process
• PLC automation
• In process gaging
• Automatic grinding and polishing cycles
• Vacuum chucks
• best TTV
• Consistent grinding results

• Fine infeed by four-phase stepping motor with infinitely variable speed;
• PLC automation;
• grinding processes storable;
• Compensation of thermal effects and grinding wheel wearing when using the gaging unit (optional). This results in very low differencies betwenn two workpieces when grinding metals with ceramic wheels.
• completely closed grinding area for cleaner and safer work and lower risk of contamination

Motor	3,7 kW
Spindle speed	2850 min-1
Power connection	5,5 kW
Accuracy	2 µm
Diamond wheel	200 x 34 x 76 mm
Rotary table	400 mm
Rotary table speed	0-30 min-1
Vakuum chucks	Poröskeramik; Anzahl grössenabhängig
Polishing wheel	200 mm; Polierpad leicht auswechselbar
Polishing agent	Slurry
Fine downfeed
Range	170 mm
min. Step	1 µm
Weight	1150 kg
Space	ca. 1550 x 1130 mm