MPS R400DS state-of-the-art grinding technologies
The MPS R400 line of machines have been designed to take advantage of state-of-the-art grinding technologies and ergonomics. The fully encapsulated grinding area offers optimum environmental conditions for the operator and reduces risks of contamination. This concept has been developed and refined for maximum precision when grinding metals, silicon and other semiconductor materials in small batch production, research and development.
Application
The major application is the grinding of silicon and GaAs in the 50 mm up to 150 mm range.
- Fully enclosed grinding area
- Diamond grinding wheels
- PLC-Control
- Measuring Unit
- minimal TTV´s
- Automatic programs
- Vacuum chucks
- Consistent grinding results
Features
- Fine infeed by four-phase stepping motor with infinitely variable speed;
- PLC automation;
- grinding processes storable;
- Compensation of thermal effects and grinding wheel wearing when using the gaging unit (optional). This results in very low differencies betwenn two workpieces when grinding metals with ceramic wheels.
- completely closed grinding area for cleaner and safer work and lower risk of contamination
Pictures
- MPS 2 R400DS
- VACUUMCLAMPING
- TWIN-SPINDLE
Special Option: MPS 2 R400DS + TWIN-SPINDLE
The TWIN-SPINDLE concept shows several oppurtunities:
- Two grinding wheels on one spindle
- Roughing and finishing in one setting
- High stock removal at finest finishes
- Unbeatable workpiece geometry
- No wheel change between roughing and fine finishing
- No secondary or rechucking of
- workpiece for fine finishing
- shortest change-over times
Technical Data
| Motor | 3,7 kW |
| Spindle speed | 2850 min-1 |
| Power connection | 5,5 kW |
| Accuracy | 2 µm |
| Diamond wheel | 200 x 34 x 76 mm |
| Rotary table | 400 mm |
| Rotary table speed | 0-30 min-1 |
| Vakuum chucks | 28 x 2" ; 16 x 3"; 8 x 4"; 5 x 5"; 4 x 6" |
| Fine downfeed | |
| Range | 170 mm |
| min. Step | 1 µm |
| Weight | 980 kg |
| Space | ca. 1550 x 1130 mm |