Grinding Machine MPS 3-134 Twin
Super finishing of mono + poly-crystalline silicon blocks for solar wafer
High precision flat grinding machine with oscillating table and two spindles.
- Prepared for robot-loading of block
- Main grinding spindle Twin type for two step grinding of the block sides.
- Second grinding spindle for simultaneously camferring the edges of the block.
- chamferring of the edges and grinding of the faces in the same clamping position (no rechucking)
- Automatic handling (loading, unloading, turning) of the block.
- Automatic grinding process
- MPS 3-134
- Grinding spindles
- Grinding principle
Conditions for best grinding results
- Do not place the machine near vibration generating systems hammers, presses etc.
- The foundation must be plane, rigid and shock free.
- The machine must be accurately adjusted in all directions with the aid of the vibration pads. Use a spirit level to adjust the machine exactly.
- The temperature of the spindle coolant water should not deviate more than ± 2°C from room temperature! The water must be filtered by > / = 5 µm.
- The pressurized air must be completely free of oil residues, filtered by 5 µm and prepared by refrigerated dryer.
- During the grinding process the temperature must be kept within a range of ±2°C to obtain best precision. A dima controlled room is recommended.
- The above specifications may change due to technical modifications. Please confirm before placing your order.
Technical Data
| block diameter | 125/150/156 mm |
| Block length | 180 - 290 mm |
| Flat grinding spindle (Twin spindle) | |
| AC Motor | 7.5 kW |
| Speeed | 500 - 4000 rpm |
| Roughing wheel | D46 |
| Finishing wheel | D15 |
| Chamfering spindle | |
| AC Motor | 2.2 kW |
| Speed | 3915 rpm |
| Grinding wheel | D15 |
| Block clamping | Vacuum |
| Block handling | Vacuum |
| El. connection | 10 kW |
| Water | 1.200 l/h (600 l per spindle) |
| Air | 15m³/h |
| Weight | 1600 kg |
| Footprint | 3000x 2100 mm |
| Height | 2440 mm |
General information
| Grinder Model | MPS 3H-134 TWIN mode (best surface) |
| Material | Silicon blocks |
| Length of block sides square-dia | 125/150/156 mm |
| Ingot length | 190mm or others in total 300 mm |
| Grinding data | |
| Grinding WheelD46/D15 TWIN mode | |
| Infeed per Cut | D46: max. 300 µm-cut, serveral cuts with 300 µm stock removal possible, |
| D15: 50 µm in one cut only possible | |
| Table Speed | 300 mm/min. rough, 200mm/min. fine |
| Grinding Coolant | 600 l/h per spindle; total approx. 1200 l/h |
| Surface roughness Ra | 0,06 µm grinding wheel D15 |
| Rmax or Ry | 0.8 µm |
| Dimension | X.0 +/- 0.4 mm |
| Angle | same as incoming, angle will not be improved |
| Chamfering | e.g. 5 +/- 0.5 mm |
| Chamfering angle | 45 +/- 0.3 Degree |
| Waviness (bow) | <=70 µm |
| Parallelism | <=70 µm |
| Target thickness | X 0.5 µm |
| Grinding wheel wear | |
| D15 > 20.000 bricks | with stock removal of 50µm per side |
| D46 > 15.000 bricks | with stock removal of 250µm per side |
| D91 > 20.000 bricks | with stock removal of 250µm per side |
| D28 > 20.000 bricks | with stock removal of 250µm per side |
| Air | 15 m3/h |
| Electric power | max. 15 KVA |