MPS 2 R300S designed for grinding semiconductor material
A adaption of the MPS 2 R300, special designed for grinding semiconductor material.
Application areas
Batch production, research and development departments, where materials such as silicon, gallium arsenide, germanium, indium phosphid, aluminum oxide, piezo ceramic, quartz, ferrite, etc. have to be ground with micron precision.
Optimum use: One-sided or back grinding of silicon and GaAs wafers up to 150 mm in diameter.
Pictures
- MPS R300S
- Chucks
Technical Data
| Motor | 2,2 kW |
| Spindle speed | 2650 min-1 |
| Power connection | 3,2 kW |
| Precision | 3 µm |
| Diamond grinding wheel | 175 x 40 x 76 mm |
| Rotary table | 300 mm |
| Rotary table speed | 0-30 min-1 |
| Vakuum chucks | 18 x 2" ; 8 x 3"; 5 x 4"; 3 x 5";2 x 6"00 mm |
| Fine downfeed | |
| range | 12 mm |
| min. step | 1 µm |
| Coolant tank | 35 l |
| Weight | 550 kg |
| Space | ca. 950 x 900 mm |