IFG 320 Facing ingots made of silicon and other semi-conductor material

Facing ingots made of silicon and other semi-conductor material up to 320 mm diameter and 600 mm length.

Clamping

The ingot is clamped mechanically on the slide. Three axis adjustment for exact positioning.

Fine infeed device

The fine infeed is driven by a four phase step motor and a circulating ball spindle. All parameters are free programmable by PLC, different grinding cycles can be stored.

Grinding head and wheel

Slide system with high precision guidance, driven by hydraulic cylinder. The grinding wheel is belt driven, grinding head and drive are completely enclosed, no access to the grinding area possible during working cycle.

Diamond cup grinding wheel, 432 mm diameter

Pictures

IFG 320
Grinding Head
Detailed view

Technical data

Motor 4 kW
Spindle speed max.1500 min-1
Accuracy 1 µm
Diamond grinding wheel  
Diameter 432 mm
Rim 10 mm
Grinding head  
Stroke 350 mm
Speed 300 mm/min
Ingot clamping  
Ingot size (ø x l) 320 x 610 mm
Adjustment horiz. ±10°
Adjustment vertical ±7°
Adjustment cross 30 mm
Main slide  
Range 200 mm
Speed 1000 mm/min
Zustellung  
Range 450 mm
Accuracy 1 µm
Speed 0-180 mm/min
Min. step 1 µm
Weight 2100 kg
Space ca. 3000 x 2000 mm