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Automatic inner diameter saw with optimal precision and reproducibility for higher production quality.

Application areas

Slicing crystals up to 200 mm diameter and 570 mm in length. The silicon and germanium mainly used in the semiconductor industry can be sliced just as precisely as GGG, samariumcobalt, ferrite, glass, ceramic, semi-precious stones, etc.

 

Working Principle

When cutting with this inner diameter saw, the crystal moves from the centre of the sawblade to the circumference. The thin sawblade derives its stability from mechanical tensioning across the clamping edge of the sawhead. Thus, a high plane movement accuracy is achieved.

The vertical arrangement of the crystal results in the particularly advantageous position of the sawhead. The crystal is fed in by a vertical slide. During the subsequent sawing operation the swingarm performs a horizontal movement. The support holds the cut wafer in the rear standby position and then swivels back into the starting position of the sawblade opening. There the cut wafer is picked up by the transfer arm and is deposited in its end position.

Automation

Together with the unloading device, the vertical arrangement of the crystal permits the automatic withdrawal of individual wafers without stopping the machine. Thus, simultaneous operation of other machines is possible. A predetermined number of wafers can also be cut semi-automatically in a packet cut.

Ergonomics

Due to the horizontal arrangement of the sawhead the work area is easily accessible and the fitting of the sawblade with the two clamping collars is readily achieved, resulting in optimum sawblade clamping and short tool change times.

Precision

The entire sawhead runs in radial and thrust aerostatic bearings and is adjustable on all levels. Together with the electronic controi and a closed loop measuring system a hitherto unrivalled infeed accuracy is achieved. The smallest infeed increment is approx. 0.6 mm with a repeatability of <+2 µm.

Capacity

Crystals up to 200 mm ø and 570 mm length can be sawn. The size of the annular sawblade also permits a simultaneous packet cut of two crystals up to 125 mm ø each giving a significant production increase.

As with the IDS 22, a wide range of accessories beyond the standard machine equipment is available with the IDS 34.

Motor	2 kW
Spindle speed	500-1500 min-1
Power connection	7 kW
Crystal size (ø x l)	200 x 570 mm
Saw blade	860 x 304 mm
Infeed
Speed (inf. variable)	0 - 150 mm/min max.
Return speed	1800 mm/min
Precision (at max stroke)	5 ± 2 µm
Adjustment	±7° (zwei Ebenen)
Thickness adjustment	0,6-6 mm
Manual traverse	90 mm/min
Coolant	bis 12 l/h
Weight	ca. 2.650 kg
Space	ca. 1870 x 1620 x 2460 mm